MAC Unit Netlist (Patent) Β Β·Β RISC-V Core (Makerchip) Β Β·Β Semiconductor Packaging (ANSYS) Β Β·Β GDSII Layout (Magic VLSI)
Aspiring VLSI Engineer Β Β·Β B.Tech EEE @ VIT Chennai Β Β·Β MS Applicant β Germany π©πͺ
I am a final-year B.Tech EEE student at VIT Chennai, working towards a career in VLSI and planning to pursue a Master's degree in Germany. Over the past two years I have completed 6 projects spanning RTL design, physical design, EDA automation, and semiconductor packaging β along with 6 publications including 2 patents, 2 SCI journal papers, and a book chapter with CRC Press. I have also done internships at CNVD VIT, CSGT VIT, Maven Silicon, and SkillDzire.
| Type | Details |
|---|---|
| ποΈ Patent [Published] | Dynamic Reconfigurable Binary Multiplier β App. No. 202541080342, Published Sep 2025 |
| ποΈ Patent [Under Review] | Low Power VLSI Design β Preetham SK (First Inventor) |
| π° SCI Journal [Under Review] | 16-Bit MAC Unit β Preetham SK (First Author) |
| π° SCI Journal [Under Review] | Low Power VLSI Design β Preetham SK (Second Author) |
| π Book Chapter [Accepted] | FPGA Based Solar Powered EV Charging Station β CRC Press, Taylor & Francis (ISBN: 9781041093626) |
| π° Research Article [Under Review] | CNN Application β Preetham SK (First Author) |
| # | Project | Tools |
|---|---|---|
| 01 | Digital VLSI SoC Design & Planning β RTL-to-GDSII on PicoRV32a; custom cell integration; ECO timing closure; DRC/LVS clean | Verilog, OpenLANE, Sky130 PDK, Magic VLSI |
| 02 | RISC-V CPU Design using TL-Verilog β 5-stage pipelined RV32I core; hazard bypassing; verified on Makerchip | TL-Verilog, Makerchip |
| 03 | VLSI Design Automation Using TCL β VSDSYNTH β Automated RTL-to-QoR framework; 6845 gates on openMSP430 | TCL, Yosys, OpenTimer, Linux |
| 04 | SPI Physical Design using Qflow β 3106 cells, 22417 routes; DRC/LVS clean; GDSII generated | Qflow, Yosys, Magic, Netgen |
| 05 | RTL Digital Design Modules using Verilog β UART, FIFO, Traffic Light, ATC, Washing Machine | Verilog HDL, ModelSim |
| 06 | Packaging Design and Simulation using ANSYS β Thermal & thermo-mechanical analysis; flip-chip BGA, QFN | ANSYS Electronics Desktop |
| Certification | Details |
|---|---|
| π CeNSE Winter School on Semiconductor Technology | Certificate of Distinction β IISc Bengaluru, Dec 2025 |
| π Chip-based VLSI Design for Industrial Applications | Specialisation β L&T EduTech via Coursera, Sep 2025 |
| π RISC-V Processor β RV32I Base ISA | Maven Silicon, Feb 2025 |
| Category | Tools |
|---|---|
| Languages | Verilog HDL, TL-Verilog, TCL, C, Python |
| EDA Tools | OpenLANE, Yosys, Magic VLSI, Qflow, Cadence NC Launch, Cadence Genus, ModelSim, Netgen, OpenTimer, HSPICE, LT Spice |
| Simulation | ANSYS Electronics Desktop, ANSYS Mechanical, Makerchip IDE |
| Platforms | Linux, Windows |